Method for calibrating an optical scanner and devices thereof

ABSTRACT

A method for calibrating an optical scanner device implemented by a calibration management apparatus, includes providing instructions to the optical scanner device to scan a calibration surface in a scan pattern based on one or more scan parameters, wherein the one or more scan parameters vary over the scan pattern. The scanning angle for each of the plurality of points in the scan pattern is computed based on an obtained image of a light source emitted from the optical scanner device at a scanning angle for a plurality of points in the scan pattern. A calibration relationship between the computed scanning angles and the corresponding scan parameters is determined for each of the plurality of points in the scan pattern.

FIELD

This technology generally relates to optical scanning devices andmethods and, more particularly, to a method, non-transitory computerreadable medium, and a calibration management apparatus for calibratingoptical scanning devices.

BACKGROUND

Nearly all manufactured objects need to be inspected after they arefabricated. A variety of optical devices have been developed for in-faband post-fab inspection. Many of these optical devices scan the surfaceof the part and are able to determine the surface profile of the partwith good accuracy. However, as the accuracy and tolerance requirementsof the part become tighter, the measurement accuracy, precision, andrepeatability of the scanning optical device must be improvedaccordingly. As a rule of thumb, the measurement device should be atleast ten times better than the required surface figure so the errors ofthe measurement device have a negligible impact on the overall errorbudget.

One way to reduce the measurement errors of the scanning optical deviceis to build the scanner from components that themselves have extremelytight tolerances. Unfortunately this approach will drive up the cost ofthe scanner and make it uneconomical for use in an in-fab or post-fabinspection environment.

A second way to reduce the measurement errors of the scanning opticaldevice is to build the scanner from components that have nominaltolerances, and then measure or otherwise calibrate the components ofthe system and merge the calibration results into an overall calibrationalgorithm. Typical components to be calibrated include the scanningdrive electronics and mechanism (offsets, gain, and nonlinearities inboth scan axes), the imaging lens (magnification, distortion, andnon-telecentricities), and the effects of the placement errors ofcomponents in the illumination arm of the scanner. Characterizing andcalibrating all of these quantities individually and then subsequentlymathematically combining them into a single calibration formula isdifficult and time-consuming. Furthermore, if a quantity isinadvertently omitted from the process, then the calibration will beincomplete and the accuracy of the scanner will be compromised.

Yet another way to minimize the measurement errors associated with thescanner is to provide a closed-loop feedback mechanism that can be usedto measure the actual scan location, and provide real-time correctionsto the scanner to ensure that the actual scan location is the same asthe desired scan location. However, the feedback mechanism generallyentails additional cost due to the inclusion of the feedback components(e.g., mirrors, electronics, lenses, image sensors), and equallyimportant will increase the size or volume of the optical scanner. Ifthe scanner must be compact so that it can fit into or measure smallrecesses of a part, then the feedback approach may not be viable.

SUMMARY

A method for calibrating an optical scanner device implemented by acalibration management apparatus, includes providing instructions to theoptical scanner device to scan a calibration surface in a scan patternbased on one or more scan parameters, wherein the one or more scanparameters vary over the scan pattern. The scanning angle for each ofthe plurality of points in the scan pattern is computed based on anobtained image of a light source emitted from the optical scanner deviceat a scanning angle for a plurality of points in the scan pattern. Acalibration relationship between the computed scanning angles and thecorresponding scan parameters is determined for each of the plurality ofpoints in the scan pattern.

A calibration management apparatus comprises memory comprisingprogrammed instructions stored thereon and one or more processorsconfigured to be capable of executing the stored programmed instructionsto provide instructions to the optical scanner device to scan acalibration surface in a scan pattern based on one or more scanparameters, wherein the one or more scan parameters vary over the scanpattern. The scanning angle for each of the plurality of points in thescan pattern is computed based on an obtained image of a light sourceemitted from the optical scanner device at a scanning angle for aplurality of points in the scan pattern. A calibration relationshipbetween the computed scanning angles and the corresponding scanparameters is determined for each of the plurality of points in the scanpattern.

A non-transitory computer readable medium having stored thereoninstructions for calibrating an optical scanner device comprisingexecutable code which when executed by one or more processors, causesthe one or more processors to provide instructions to the opticalscanner device to scan a calibration surface in a scan pattern based onone or more scan parameters, wherein the one or more scan parametersvary over the scan pattern. The scanning angle for each of the pluralityof points in the scan pattern is computed based on an obtained image ofa light source emitted from the optical scanner device at a scanningangle for a plurality of points in the scan pattern. A calibrationrelationship between the computed scanning angles and the correspondingscan parameters is determined for each of the plurality of points in thescan pattern.

Accordingly, the present technology provides a method and apparatus forcalibrating the errors associated with an optical scanner in which theerrors are characterized at the system level using a simple and fastprocedure, requiring the use of only one additional piece of hardware—aplanar calibration artifact. The present technology advantageouslyreduces the measurement errors of a diminutive and economicalthree-dimensional optical scanning device built from components thatagain have nominal tolerances by measuring or otherwise calibrating thescanner as a whole. The scanner may then advantageously be operatedwithout the use of a feedback mechanism.

The procedure for calibrating the scanner entails placing the planarcalibration artifact at the nominal measurement plane of the scanner,and then causing the scanner to scan across the planar calibrationartifact in a well-defined scan pattern. At each scan point of the scanpattern, the actual scan angle is determined and compared against theprescribed scan angle. At the completion of the process a map of thescan angle errors is then available for use for correcting substantiallyall of the errors of the scanner.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a functional block diagram of a three-dimensional opticalscanning system including an exemplary calibration management apparatus;

FIG. 2 is a block diagram of an exemplary calibration managementapparatus;

FIG. 3 is a side view of a three-dimensional optical scanner device;

FIG. 4 is a plan view of a three-dimensional optical scanner device;

FIG. 5 is a side view of a three-dimensional optical scanner deviceshowing the envelope of the light paths associated with thethree-dimensional optical scanner device;

FIG. 6 is a diagram that illustrates and defines the variables and otherquantities used in the mathematical analysis of the calibration of athree-dimensional optical scanner device;

FIG. 7 is a flowchart of the calibration algorithm used to calibrate thethree-dimensional optical scanner device;

FIG. 8 is an image of the cross-hair projected onto the planarcalibration device used to calibrate the three-dimensional opticalscanner device;

FIG. 9 is an example of the serpentine scan path followed during thecalibration of a three-dimensional optical scanner device;

FIG. 10 is an example of the scan points used for calibrating thethree-dimensional optical scanner device using the scan pattern of FIG.9;

FIG. 11 is the resulting calibrating surface, after the linear portionhas been removed, used to eliminate the errors of the three-dimensionaloptical scanner device associated with the theta scan direction;

FIG. 12 is the resulting calibrating surface, after the linear portionhas been removed, used to eliminate the errors of the three-dimensionaloptical scanner device associated with the phi scan direction;

FIG. 13 is a graph of the MEMS X-Channel drive voltage as a function ofthe required theta and phi scan angles;

FIG. 14 is a graph of the MEMS X-Channel drive voltage as a function ofthe required theta and phi scan angles, with the linear portion removed;

FIG. 15 is a graph of the MEMS Y-Channel drive voltage as a function ofthe required theta and phi scan angles;

FIG. 16 is a graph of the MEMS Y-Channel drive voltage as a function ofthe required theta and phi scan angles, with the linear portion removed;and

FIG. 17 is an exemplary flowchart of an exemplary method of utilizingthe calibration relationship determined using the calibration algorithmof the present technology.

DETAILED DESCRIPTION

Referring to FIG. 1, an exemplary optical scanning system 10 with anexemplary calibration management apparatus 64 is illustrated. Thecalibration management apparatus 64 in this example is coupled to aoptical scanner device 54 including a source arm and an imaging arm,both of which can contribute to scanner errors that can be mitigated bythe present the present technology. In this example, the calibrationmanagement apparatus 64 is coupled to the optical scanner device 54through an image digitizer 56, digital-to-analog (D/A) converters 60,66X, and 66Y, a light source driver 62, a MEMS (Micro Electro-MechanicalSystem) X-channel driver 68X, and MEMS Y-channel driver 68Y, and aZ-translational stage 70, although the exemplary optical scanning system10 may include other types and numbers of devices or components in otherconfigurations. This technology provides a number of advantagesincluding methods, non-transitory computer readable media, andcalibration management apparatuses that facilitate more efficientcalibration of a three-dimensional optical scanner device without theuse of a feedback loop.

Referring now to FIGS. 1 and 2, the calibration management apparatus 64in this example includes one or more processors 120, a memory 122,and/or a communication interface 124, which are coupled together by abus 126 or other communication link, although the calibration managementapparatus 64 can include other types and/or numbers of elements in otherconfigurations. The processor(s) 120 of the calibration managementapparatus 64 may execute programmed instructions stored in the memory122 for the any number of the functions described and illustratedherein. The processor(s) 120 of the calibration management apparatus 64may include one or more CPUs or general purpose processors with one ormore processing cores, for example, although other types of processor(s)can also be used.

The memory 122 of the calibration management apparatus 64 stores theseprogrammed instructions for one or more aspects of the presenttechnology as described and illustrated herein, although some or all ofthe programmed instructions could be stored elsewhere. A variety ofdifferent types of memory storage devices, such as random access memory(RAM), read only memory (ROM), hard disk, solid state drives, flashmemory, or other computer readable medium which is read from and writtento by a magnetic, optical, or other reading and writing system that iscoupled to the processor(s) 120, can be used for the memory 122.

Accordingly, the memory 122 of the calibration management apparatus 64can store one or more applications or programs that can include computerexecutable instructions that, when executed by the calibrationmanagement apparatus 64, cause the calibration management apparatus 64to perform actions described and illustrated below with reference toFIGS. 7-17. The application(s) can be implemented as modules orcomponents of other applications. Further, the application(s) can beimplemented as operating system extensions, module, plugins, or thelike.

Even further, the application(s) may be operative in a cloud-basedcomputing environment. The application(s) can be executed within or asvirtual machine(s) or virtual server(s) that may be managed in acloud-based computing environment. Also, the application(s) may berunning in one or more virtual machines (VMs) executing on thecalibration management apparatus 64.

The communication interface 124 of the calibration management apparatus64 operatively couples and communicates between the calibrationmanagement apparatus 64 and the image digitizer 56, thedigital-to-analog (D/A) converters 60, 66X, and 66Y, the light sourcedriver 62, the MEMS X-channel driver 68X, and the MEMS Y-channel driver68Y as known in the art. In another example, the calibration managementapparatus 64 is a highly integrated microcontroller device with avariety of on-board hardware functions, such as analog to digitalconverters, digital to analog converters, serial buses, general purposeI/O pins, RAM, and ROM.

Although the exemplary calibration management apparatus 64 is describedand illustrated herein, other types and/or numbers of systems, devices,components, and/or elements in other topologies can be used. It is to beunderstood that the systems of the examples described herein are forexemplary purposes, as many variations of the specific hardware andsoftware used to implement the examples are possible, as will beappreciated by those skilled in the relevant art(s).

In addition, two or more computing systems or devices can be substitutedfor the calibration management apparatus 64. Accordingly, principles andadvantages of distributed processing, such as redundancy and replicationalso can be implemented, as desired, to increase the robustness andperformance of the devices and systems of the examples. The examples mayalso be implemented on computer system(s) that extend across anysuitable network using any suitable interface mechanisms and traffictechnologies, including by way of example only teletraffic in anysuitable form (e.g., voice and modem), wireless traffic networks,cellular traffic networks, Packet Data Networks (PDNs), the Internet,intranets, and combinations thereof.

The examples may also be embodied as one or more non-transitory computerreadable media having instructions stored thereon for one or moreaspects of the present technology as described and illustrated by way ofthe examples herein. The instructions in some examples includeexecutable code that, when executed by one or more processors, cause theprocessors to carry out steps necessary to implement the methods of theexamples of this technology that are described and illustrated herein.

Referring now to FIGS. 1 and 3-5, an example of the optical scannerdevice 54 and its operation are illustrated. The calibration process ofthe present technology is applicable to nearly any three-dimensionaloptical scanner, although in particular it is most applicable tothree-dimensional optical scanners that are compact and operate withoutbenefit of a feedback loop. An exemplary scanner assembly device thatmay be utilized with the present technology is disclosed in U.S. patentapplication Ser. No. 15/012,361, the disclosure of which is incorporatedherein by reference in its entirety. In this example, the scannerassembly includes a light source 12, a reticle 16, a source baffle 18, aprojection lens 20, a right angle prism lens 22, a MEMS 24, a MEMSmirror 26, a source window 28, an imaging window 34, a first lenselement 36, a fold mirror 40, an aperture stop 42, a second lens element44, an optical filter 48, an image sensor 50, in a cylindrical housing52, although the optical scanner device 54 may include other typesand/or numbers of other devices or components in other configurations.

Referring now to FIGS. 3-5, the optical scanner device 54, whose housing52 is cylindrically shaped and contains a source arm and an imaging arm,both of which can contribute to scanner errors that can be mitigated bythe present invention.

The source arm of the optical scanner device 54 includes the lightsource 12, such as an LED, nominally centered on a light source axis 14whose source light 13 is incident on the reticle 16. The reticle 16 issubstantially opaque with the exception of a transparent aperture thatis also nominally centered on the light source axis 14, and orthogonalto it. The transparent aperture of the reticle 16 can have a circularshape, or instead have a pattern such as a cross-hair pattern, thattransmits through it any of the source light 13 incident upon it. Thereticle light 15 is that portion of the source light 13 that passesthrough the reticle 16, and the reticle light 15 is in turn incident onthe source baffle 18, which also has an aperture. The projection lens 20is positioned in the aperture of the source baffle 18. The reticle light15, whose envelope is generally divergent, that is incident on theprojection lens 20 is transmitted through the projection lens 20 andexits as projection lens light 21 whose envelope is generallyconverging.

The projection lens light 21 then enters a short side of the right angleprism 22, is reflected from the hypotenuse of the right angle prism 22,and then exits through the second short side of the right angle prism 22as prism light 23. The prism light 23 is then incident on the MEMSmirror 26 of the MEMS 24, and is reflected from the MEMS mirror 24 intoprojected light 27 in accordance with the law of reflection. Theprojected light 27 then passes through the source window 28 and comes toa focus on a calibration object 30. In this example, the calibrationobject 30 is a planar calibration objection although other types and/ornumbers of calibration objects having other configurations may beemployed.

In this example, the aperture of the reticle 16 has the shape of across-hair such that the image produced by the projected light 27 on theplanar calibration object 30 also has a cross-hair shape. A cross-hairshaped reticle aperture and a cross-hair shaped projected light image 31will be assumed for the balance of this disclosure, although otheraperture and image shapes are possible, such as round, cross-hatched,etc.

Referring again to FIGS. 3 through 5, it is shown that a portion of theprojected light 27 incident on the planar calibration object 30 isreflected as reflected image light 33, a portion of which passes throughthe imaging window 34 and the first lens element 36. The first lenselement 36 causes the diverging reflected image light 33 incident uponit to exit as converging first lens element light 37, which thenreflects from the fold mirror 40, and a portion of which passes throughthe aperture stop 42 as apertured light 43.

The apertured light 43 is then incident on the second lens element 44which causes the apertured light 43 to come to a focus at image 51 onthe image sensor 50 after passing through the optical filter 48. Theimage 51 is an image of the projected light image 31, and is cross-hairshaped if the projected light image 31 is also cross-hair shaped. Thefirst lens element 36 acts cooperatively with the aperture stop 42 andthe second lens element 44 to form a telecentric lens in which themagnification of the imaging system does not change substantially withchanges in the distance between the planar calibration object 30 (i.e.,the elevation of the projected light image 31) and the imaging window 34(i.e., the elevation of the optical scanner device 54).

Referring again to FIG. 1, the electro-mechanical coupling between thecalibration management apparatus 64 and the optical scanner device 54 ofthe present technology will now be described. As seen in FIG. 1, thecentral calibration management apparatus 64 is used to control theelectro-mechanical functional blocks controlling the optical scannerdevice 54. In particular, one digital output of the calibrationmanagement apparatus 64 is coupled to an input of the D/A(digital-to-analog) converter 60 whose output is coupled to an input ofthe light source driver 62 whose output is then coupled to the lightsource 12 within the optical scanner device 54. In this way thecalibration management apparatus 64 can control the amount of lightemitted by the light source 12.

Similarly, another digital output of the calibration managementapparatus 64 is coupled to an input of the D/A converter 66X whoseoutput is coupled to an input of the MEMS X-channel driver 68X whoseoutput is then coupled to a first input of the MEMS 24 within theoptical scanner device 54. In this way, the calibration managementapparatus 64 can control the angular tilt of the MEMS mirror 26 aboutthe X-axis. Additionally, another digital output of the calibrationmanagement apparatus 64 is coupled to an input of the D/A converter 66Ywhose output is coupled to an input of the MEMS Y-channel driver 68Ywhose output is then coupled to a second input of the MEMS 24 within theoptical scanner device 54. In this way, the calibration managementapparatus 64 can control the angular tilt of the MEMS mirror 26 aboutthe Y-axis.

Yet another digital output of calibration management apparatus 64 iscoupled to the Z-translation stage 70, which is used to raise or lowerthe planar calibration object 30 (or alternately raise or lower theoptical scanner device 54), so the distance between the planarcalibration object 30 and the optical scanner device 54 can be variedunder the control of the calibration management apparatus 64. Thisdistance needs to be varied, for example, to optimize the quality of thefocus of the projected light image 31 at the planar calibration object30, or for volumetric calibration as described later.

Continuing to refer to FIG. 1, it is seen that the output of the imagesensor 50 within the optical scanner device 54 is coupled to an input ofthe image digitizer 56 which samples the video signal output by theimage sensor 50 and converts it to a digital representation of the image51 produced on the input face of the image sensor 50. The digitalrepresentation of the image created by the image digitizer 56 is thenoutput to a digital input of the calibration management apparatus 64 sothat the calibration management apparatus 64 can access and process theimages produced by the optical scanner device 54.

Before discussing the error sources within the three-dimensional opticalscanning system 10, the triangulation math and algorithm executed by thecalibration management apparatus 64 will now be discussed with respectto FIG. 6. Also referring to FIGS. 3-5, the coordinate system is definedsuch that the X-axis is along the axis of the optical scanner device 54,the Y-axis is to a side of the optical scanner device 54, and the Z-axisruns up-down through the optical scanner device 54.

Points of interest illustrated in FIG. 6 include the center of the MEMSmirror 26 (X_(M), 0, Z_(M)) and the location where the projected lightimage 31 intersects the planar calibration object 30 at (X_(R), Y_(R),0). Note that the center of the MEMS mirror 26 is assumed to passthrough the Y=0 plane, and the planar calibration object 30 lies withinthe Z=0 plane. Vectors of interest within FIG. 6 include Vector I, whichis the center of the light bundle (i.e., prism light 23) that isincident on the MEMS mirror 26; Vector N which is a vector that isperpendicular to MEMS mirror 26; and Vector R which is the center of thelight bundle (i.e. projected light 27) that reflects from MEMS mirror26. Note that Vectors I, N, and R all nominally pass through point(X_(M), 0, Z_(M)) in an ideal (i.e., zero tolerance) scanner system.Also note that in an ideal system Vectors I, N, and R also lie in thesame plane—the plane of reflection—and the angle between Vectors I and Nis defined to be Angle α which is also the angle between Vectors N and Rin accordance with the Law of Reflection.

Other linear quantities illustrated in FIG. 6 include vector componentsA_(I) and C_(I) for Vector I such that I=A_(I)X+C_(I)Z (B_(I) is assumedto be zero); vector components A_(N), B_(N), and C_(N) for Vector N suchthat N=A_(N)X+B_(N)Y+C_(N)Z; and vector components A_(R), B_(R), andC_(R) for Vector R such that R=A_(R)X+B_(R)Y+C_(R)Z. Angular quantitiesillustrated in FIG. 6 include angle ϕ_(I) which is the angle betweenVector I and the X-axis; angle ϕ_(N) which is the angle between Vector Nand the X-axis; angle ϕ_(R) which is the angle between Vector R and theX-axis; angle θ_(R) which is the angle between Vector R and the X-Zplane; and angle θ_(N) which is the angle between Vector N and the X-Zplane.

The three-dimensional optical scanner system 10 including opticalscanner device 54 relies upon a triangulation algorithm to convert thetwo-dimensional information encoded in the position of the image 51 onthe image sensor 50 into a three-dimensional location of the projectedlight image 31 on a test object 72. This triangulation algorithm willnow be described with reference to FIG. 6. Note that FIG. 6 shows aplanar calibration device 30 at Z=0 as the object under test, althoughthe following description is general and a curved test object 72 can beassumed as well. The inputs to the triangulation algorithm are the Y andZ location of the image 51 on the image sensor 50 (hereafter denotedY_(i) and Z_(i), respectively), the magnification, M, of the telecentriclens, the angle ϕ_(I) of the incident light vector I, the scan angles,ϕ_(N) and θ_(N) associated with the normal vector N of the MEMS mirror26, and the center coordinates X_(M) and Z_(M) of the MEMS mirror 26.The goal is to compute the spatial location (X_(o), Y_(o), Z_(o)) of theprojected light image 31 on the test object 72.

The first step in the triangulation algorithm is to compute thedirection cosines of Vector I, which are A_(I)=cos ϕ_(I), B_(I)=0, andC_(I)=cos ϕ_(I). Next, the direction cosines for Vector N are computed,which are A_(N)=−cos θ_(N) cos ϕ_(N), B_(N)=sin θ_(N), and C_(N)=cosθ_(N) sin ϕ_(N). In this disclosure vectors I, N, and R are defined suchthat they all point to the center of the MEMS mirror (X_(M), 0, Z_(M))even though Vector N by convention usually points away from the surfacenormal and the flow of light associated with Vector R is away from thereflection. Vectors I, N, and R also all lie in the same plane, the“plane of reflection”. Next, by inspection of angle α, it is seen thatα=arccos(I·N)=arccos(N·R), or in other words I·N=N·R, where “·” denotesthe vector dot product. This means thatA_(I)A_(N)+C_(I)C_(N)=A_(N)A_(R)+B_(N)B_(R)+C_(N)C_(R), orC_(R)=(A_(I)A_(N)+C_(I)C_(N)−A_(N)A_(R)−B_(N)B_(R))/C_(N). Next define aVector P (not shown in FIG. 6) which is perpendicular to the plane ofreflection, which means that P=I×N and P=N×R, where “×” denotes thevector cross product, and consequently I×N=N×R. Next the cross productis executed and the Z direction cosines are set equal to one another tosolve for A_(R)=(A_(N)B_(R)−A_(I)B_(N))/B_(N). Similarly the crossproduct is executed and the X direction cosines are set equal to oneanother to solve to for B_(R)=(B_(N)C_(I)+B_(N)C_(R))/C_(N). The threesimultaneous equations for A_(R), B_(R), and C_(R) are then solved sothey are only a function of the components of Vector I and Vector N,resulting in:A _(R)=2A _(N)(A _(I) A _(N) +C _(I) C _(N))−A _(I)  (1)B _(R)=2B _(N)(A _(I) A _(N) +C _(I) C _(N))  (2)C _(R)=2A _(I) C _(N) A _(N)+2C _(I) C _(N) ² −C _(I)  (3)

The next step in the triangulation algorithm is to compute the actualspatial coordinates of the center of the projected light image 31 on thetest object 72 from the direction cosines A_(R), B_(R), and C_(R) andfrom the location of the image 51 (X_(i) and Z_(i)) on the image sensor50. By inspection, Y_(o)=Y_(i)/M and X_(o)=Z_(i)/M. Next defineparameter T such that T=(X_(o)−X_(M))/A_(R), T=(Y_(o)−Y_(M))/B_(R), andT=(Z_(o)−Z_(M))/C_(R). After T is calculated from the expressionT=(Y_(o)−Y_(M))/B_(R), Z_(o) can be computed as Z_(o)=C_(R)T+Z_(M). Atthis juncture the location of the spatial coordinates of the center ofthe projected light image 31 on the test object (X_(o), Y_(o), andZ_(o)) are now known.

This triangulation algorithm depends critically on the accurateplacement of the image 51 on the image sensor 50 and on the accurateplacement of the projected light image 31 on the test object 72 whichalso influences the placement of the image 51 on the image sensor 50.This critical dependence on the accurate placement of the image 51 onthe image sensor 50 is quickly gleaned from the relationshipsY_(o)=Y_(i)/M and X_(o)=Z_(i)/M: if Y_(i) and Z_(i) are incorrect due toelectro-opto-mechanical tolerances within the three-dimensional opticalscanner system 10, then Y_(o) and X_(o) (as well as Z_(o)) will all beincorrect as well. Since it is generally not economical to drive allelectro-opto-mechanical tolerances to zero, the calibration processprescribed in the present technology is necessary to account for imageplacement errors associated with Y_(i) and Z_(i), and substantiallyeliminate the errors in the computed coordinates (X_(o), Y_(o), andZ_(o)).

As mentioned earlier, the three-dimensional optical scanner system 10operates without benefit of a feedback loop, meaning the actualdirection of the projected light 27 will probably not be the same as theexpected direction of the projected light 27. This means that when thecalibration management apparatus 64 processes the imaged cross-hairlocation and computes a three-dimensional location of the cross-hair ona part being measured, this difference in the actual versus expectedprojection angle will introduce serious errors in the computed locationof the cross-hair on the part being measured. Indeed, any electrical,optical, or mechanical tolerance within the three-dimensional opticalscanner system 10 that causes the actual placement of the image of thecross-hair on the image sensor 51 to be different from where it shouldbe if the three-dimensional optical scanner were perfect (i.e., alltolerances were zero) will cause errors in the triangulation algorithmexecuted by the calibration management apparatus 64 with the result thatthe computed three-dimensional location of the cross-hair will also haveerror.

As an example, if the placement of the light source 12 was slightlyoffset, then the source light 13, the reticle light 15, and the prismlight 23 would all have a bias which results in the projected lightimage 31 having a brighter side and a dimmer side, which introduces asubtle offset in the actual location of the image 51 of the projectedlight image 31 on the image sensor 50. The result of this subtle offsetwill be that the cross-hair localization algorithm executed by thecalibration management apparatus 64 will compute a different cross-hairlocation than if the light source 12 had zero placement offset. Thedifferent cross-hair location will in turn result in an error in thecomputed three-dimensional location of the cross-hair on the part afterthe triangulation algorithm is executed.

Another source of error is associated with the location of reticle 16.If the reticle 16 is mis-positioned in the Y or Z directions then thestarting point of Vector I will be mis-positioned accordingly, andVector R will subsequently not be in the position it is expected to bein by the triangulation algorithm executed by the calibration managementapparatus 64. As described with other error sources, the actual locationof the projected light image 31 on the test object will not be where itshould be, and the actual location of image 51 on the image sensor 50will not be where it should be, resulting in an error in the computedthree-dimensional location of the cross-hair on the part after thetriangulation algorithm is executed.

Indeed, any opto-mechanical tolerance that induces an error in Vector Iwill cause Vector R and the positioning of the projected light image 31and the image 51 to be in error, resulting in an error in the computedthree-dimensional location of the cross-hair on the part after thetriangulation algorithm is executed. Opto-mechanical tolerances that cancause errors in Vector I include: angular tip or tilt of the projectionlens 20, lateral mis-placement in Y or Z of the projection lens 20;angular tip or tilt of the prism 22; and lateral mis-placement in X, Y,or Z of the prism 22.

Similarly, any electro-opto-mechanical tolerance that induces an errorin Vector N will subsequently cause Vector R and the positioning of theprojected light image 31 and the image 51 to be in error, resulting inan error in the computed three-dimensional location of the cross-hair onthe part after the triangulation algorithm is executed.Electro-opto-mechanical tolerances that can cause errors in Vector Ninclude: lateral mis-placement of the MEMS 24 in the X, Y, or Zdirection; angular misplacement of the MEMS 24; lateral misplacement ofthe MEMS mirror 26 within the MEMS 24 in the X, Y, or Z direction;angular misplacement of the MEMS mirror 26 within the MEMS 24;non-linearities in the D/A Converters 66X and 66Y; non-linearities inthe MEMS Drivers 68X and 68Y; and non-linearities and cross-talk withinthe MEMS 24. The MEMS 24 lateral misplacements, as well as the thicknessof the MEMS mirror 26, cause the point of angular rotation of the MEMSmirror 26 to not be at the point (X_(M), 0, Z_(M)), the nominalintersection point of Vectors I, N, and R which will cause errors inboth Vectors N and R. The electronic errors associated with the MEMSDrivers 68X and 68Y, and the MEMS D/A's 66X and 66Y, will cause errorsin the MEMS drive voltages V_(XMEM)S and V_(YMEMS) which will cause theMEMS mirror (i.e., Vector N) to be pointing in the wrong direction.Likewise, imperfections in the electro-mechanical characteristics of theMEMS 24 will also cause Vector N to have errors even if the MEMS drivevoltages V_(XMEMS) and V_(YMEMS) are correct.

Lastly, even if Vectors I, N, and R are error-free, opto-mechanicaltolerances associated with the telecentric lens (which includes thefirst lens element 36, the aperture stop 42, and the second lens element44), the imaging window 34, the fold mirror 40, the optical filter 48,and/or the image sensor 50 can cause errors in the placement of theimage 51 on the image sensor 50, resulting in an error in the computedthree-dimensional location of the cross-hair on the part after thetriangulation algorithm is executed.

Specifically, if the imaging window 34 has wedge, then the reflectedimage light 33 can be refracted by the imaging window 34 into adirection whose centerline is not coincident or parallel with an objectspace axis 38 after it is transmitted through the imaging window 34.Similarly, if the fold mirror 40 is not aligned properly or deviatessignificantly from planarity, then the fold mirror light 41 can bereflected by the fold mirror 40 into a direction whose centerline is notcoincident or parallel to the image space axis 46. If the optical filter48 has wedge, then the filtered light 49 can be refracted by the opticalfilter 48 into a direction whose centerline is not coincident orparallel with the image space axis 46 after it is transmitted throughthe optical filter 48. Any of these three propagation errors can andwill cause the location of the image 51 on the image sensor 50 to not bewhere it should be if these errors were absent, with the result of anerror in the computed three-dimensional location of the cross-hair onthe test object 72 after the triangulation algorithm is executed.

The telecentric lens, which includes the first lens element 36, theaperture stop 42, and the second lens element 44, is designed to bedoubly-telecentric such that the magnification does not change withchanges in the distance between the first lens element 36 and the lensobject (i.e., projected light image 31) as well as with changes in thedistance between the second lens element 44 and the image sensor 50.Accordingly, designing the lens to be doubly-telecentric will minimizeerrors in image placement on the image sensor 50 as either the front orback focal distance changes. However, since no lens design is perfect,some residual non-telecentricity will be present, meaning the actuallocation of the image 51 on the image sensor 50 will not be where itideally should be, resulting in an error in the computedthree-dimensional location of the cross-hair on the part after thetriangulation algorithm is executed. Similarly, the telecentric lensshould be designed so that its optical distortion (e.g., barrel orpincushion distortion) is driven to zero, so that there are no imageplacement errors due to distortion. However, since no lens design isperfect, some residual distortion will be present, meaning the actuallocation of the image 51 on the image sensor 50 will not be where itideally should be, resulting in an error in the computedthree-dimensional location of the cross-hair on the part after thetriangulation algorithm is executed.

Furthermore, if, due to opto-mechanical tolerances, any of the threecomponents of the telecentric lens are not located where they should be,then the distortion and telecentricity of the telecentric lens willdegrade. This degradation will again cause the actual location of theimage 51 on the image sensor 50 to not be where it ideally should be,resulting in an error in the computed three-dimensional location of thecross-hair on the part after the triangulation algorithm is executed.

An exemplary method of calibrating an optical scanner device to addressthe errors discussed above will now be described with reference to FIGS.1-16. At step 700, the exemplary calibration process is started. Next,at step 702, the calibration management apparatus 64 providesinstructions to the optical scanner device 54 to move the light sourceemitted from the optical scanner device 54 to a point on the calibrationsurface, such as planar calibration surface 30 as shown in FIG. 3, in ascan pattern.

The point to which the optical scanner device 54 is directed to in step702 is based on one or more scan parameters. In this example, the scanparameter utilized is a voltage used to control the angular position ofthe MEMS mirror 26 in the optical scanner device 54, such that thevoltage employed to obtain a specific angular position of the MEMSmirror 26 corresponding to a discrete point on the calibration surface.The angular position of the MEMS mirror 26 in turn determines thescanning angle of the optical scanner device 54. By way of example, thecalibration management apparatus 64 commands the D/A Converter 66X andthe D/A Converter 66Y to output known voltages V_(XMEMS) and V_(YMEMS),respectively, that are used to drive the MEMS mirror 26 to anuncalibrated angular position whose actual angular position is notprecisely known. This angular position is characterized by the directioncosines of the MEMS normal Vector N (i.e., A_(N), B_(N), and C_(N)), orequivalently by angles θ_(N) and ϕ_(N), as shown in FIG. 6, which mustbe computed from a cross-hair image 51 captured by the image sensor 50and subsequently digitally transferred to the calibration managementapparatus 64 for processing.

In step 704, calibration management apparatus 64 receives a digitalrepresentation of an image obtained of the light source emitted from theoptical scanner device 54 for processing. A digital representation ofthe image is obtained for each of the plurality of points in the scanpattern. In this example, the optical scanner device 54 creates across-hair image 51. FIG. 8 is an illustrative image of the cross-hairimage 51 captured by the image sensor 50 in which the cross-hair hasbeen projected onto the planar calibration object 30, by way of example.Although cross-hair images are described, other types and numbers ofimage shapes may be utilized.

Next, in step 706, the calibration management apparatus 64 computes thescanning angle at the point in the scan pattern for which the image wasobtained. This bitmap image is processed by the calibration managementapparatus 64 to determine the crossing point of the arms of thecross-hair, which is the point having coordinates Y_(i) and Z_(i), asshown in FIG. 6. The actual determination of the MEMS mirror 26 normalVector N is accomplished by first computing the components of Vector R:A_(R)=Z_(i)/M−X_(M); B_(R)=Y_(i)/M−Y_(N); and C_(R)=−Z_(M). Note A_(R),B_(R), and C_(R) are then normalized by dividing each by the magnitudeof Vector R. Next, by using Equations 1 and 2, above, as well as theequation A_(N) ²+B_(N) ²+C_(N) ²=1, the three components of Vector N canbe computed, which are:A _(N)=(A _(R) +A _(I))/sqrt[(A _(R) +A _(I))² +B _(R) ²+(C _(R) +C_(I))²]  (4)B _(N) =B _(R)/sqrt[(A _(R) +A _(I))² +B _(R) ²+(C _(R) +C _(I))²]  (5)C _(N)=(C _(R) +C _(I))/sqrt[(A _(R) +A _(I))² +B _(R) ²+(C _(R) +C_(I))²]  (6)The MEMS mirror 26 angles (scanning angles) θ_(N) and ϕ_(N) are thencalculated from A_(N), B_(N), and C_(N).

Next, in step 708, the calibration management apparatus 64 stores thecomputed scanning angle values θ_(N) and ϕ_(N), as well as the one ormore scan parameters associated with the scanning angle values, such asknown MEMS drive voltages, V_(XMEMS) and V_(YMEMS), by way of example ina table in the memory 122 in the calibration management apparatus 64 forlater use by the calibration process. The computed scanning values andthe associated one or more scan parameters may be stored in otherlocations on other devices coupled to the calibration managementapparatus 64.

At step 710, the calibration management apparatus 64 determines whethera scan pattern over the planar calibration surface 30, by way ofexample, for the calibration process is complete. If in step 710, thecalibration management apparatus 64 determines that the scan pattern isincomplete, the No branch is taken back to step 702 where the process isrepeated for a new point on the planar calibration surface.

By way of example, new values of V_(XMEMS) and V_(YMEMS) are determinedby the calibration management apparatus 64 and the MEMS mirror 26 isangularly rotated to a new uncalibrated angular position whose actualangular position is not precisely known. The process is then repeatedfor a number of points in a scan pattern including a plurality ofdiscrete points on the planar calibration surface 30. The number ofpoints in the scan pattern may vary based on the application. In thisexample, the scan patter is one-dimensional, although two-dimensionalscan patterns such as a serpentine pattern, a raster pattern, a randompattern, or a pseudo-random pattern, by way of example only, may beemployed. The drive voltages V_(XMEMS) and V_(YMEMS) associated witheach scan point in the scan pattern of the calibration process are suchthat the scan points are fairly well spaced apart and cover the regionof interest that needs to be calibrated across the field of view of theplanar calibration object 30 and/or the test object 72.

FIG. 9 shows an example of a two-dimensional serpentine scan pattern asa function of rotation of the scanning angles of the MEMS scan mirror26. FIG. 10 shows an example of the scan points across the field of viewin the two-dimensional serpentine scan pattern shown in FIG. 9, in whichthere are 31 points in the Y-direction, 25 points in the orthogonaldirection, and 21 scan points have been removed from each corner becausethey are outside the region of interest, although other number of pointsin the two directions are possible as well, and more or fewer points canbe removed from the corners. FIG. 11 shows the actual values of θ_(N)for each calibration scan point as a function of V_(XMEMS) and V_(YMEMS)and FIG. 12 shows the actual values of ϕ_(N) for each calibration scanpoint as a function of V_(XMEMS) and V_(YMEMS). In both FIG. 11 and FIG.12 the linear components of θ_(N) and ϕ_(N) have been artificiallysuppressed so the non-linear components, which contain the majority ofthe uncalibrated errors, are more pronounced for illustration purposes.

Referring again to FIG. 7, if in step 710 the calibration managementapparatus 64 determines that the scan pattern is complete, the Yesbranch is taken to step 712 where the calibration management apparatusdetermines a calibration relationship between the computed scanningangles θ_(N) and ϕ_(N) and the corresponding scan parameters, in thisexample the V_(XMEMS) and V_(YMEMS) values for the angular position ofthe MEMS mirror 26, for each of the plurality of points in the scanpattern. In one example, a polynomial is fit to the data of V_(XMEMS) asa function of MEMS mirror angles θ_(N) and ϕ_(N) and a polynomial isalso fit to the data of V_(YMEMS) as a function of MEMS mirror anglesθ_(N) and ϕ_(N) to provide the calibration relationship. However, othermethods of providing a calibration relationship, such a storing alook-up table of values correlating the scanning angles and thecorresponding scan parameters for each of the plurality of points in thescan pattern, as described in further detail below, may be employed. Anexemplary polynomial is shown in Equation 7 below:V _(MEMS) =A ₀ +A ₁θ_(N) +A ₂θ_(N) ² +A ₃θ_(N) ³ +A ₄θ_(N) ⁴ +A ₅θ_(N) ⁵+A ₆θ_(N) ⁶ +A ₇θ_(N) ⁷ +A ₈ϕ_(N) +A ₉ϕ_(N) ² +A ₁₀θ_(N)ϕ_(N) +A ₁₁θ_(N)²ϕ_(N) +A ₁₂θ_(N)ϕ_(N) ² +A ₁₃θ_(N) ²ϕ_(N) ²  (7)although other polynomial expressions having fewer or more terms can beused, or equations having non-polynomial terms such as exponentials,inverse-exponentials, trigonometric, inverse-trigonometric, etc. termscan be used. Note that during the fitting process the coefficients A₀through A₁₃ are computed, typically with a regression algorithm,although other types of fitting methods can be used such as those thatare iterative in nature.

The calibration polynomials are strongly linear in that the A₁coefficient is far from zero (or A₈ if the polynomial is V_(XMEMS))while coefficients A₂ through A₁₃ are generally small (albeit stillsignificant). Indeed, as shown in FIG. 13, V_(XMEMS) has a strong lineardependence on ϕ_(N), which masks the dependence on θ_(N) and thenon-linearities present in ϕ_(N). If the linear term is artificially setto zero, the effect of the remaining terms on V_(XMEMS) becomes apparentas shown in FIG. 14. The surface of FIG. 14 illustrates thenon-linearities present in the three-dimensional optical scanner device54 in the X-direction. These non-linearities generally arise from theelectro-opto-mechanical errors listed earlier. Similarly, as shown inFIG. 15, V_(YMEMS) has a strong linear dependence on the θ_(N), whichmasks the dependence on ϕ_(N) and the non-linearities present in θ_(N).If the linear term is artificially set to zero, the effect of theremaining terms on V_(YMEMS) becomes apparent as shown in FIG. 16. Thesurface of FIG. 16 illustrates the non-linearities present in thethree-dimensional optical scanner device 54 in the Y-direction. Thesenon-linearities also generally arise from the electro-opto-mechanicalerrors listed earlier.

Next in optional step 714, the calibration management apparatus 64adjusts a distance in the Z-direction between the optical scanner device54 and the planar calibration surface 30 as shown in FIG. 3, by way ofexample, by providing instructions to the Z-translational stage 70, asshown in FIG. 1, to move the optical scanner device 54 to generate athree-dimensional scan pattern. The calibration process described aboveassumed that the planar calibration device 30 was located at oneelevation in Z, namely Z=0.0, during the calibration process. By way ofexample, the calibration process may be completed at more than one knownelevation, such as at Z=−0.60 mm, Z=0.00 mm, and at Z=0.60 mm, althoughother numbers of elevations and Z-elevations can be used.

The advantage of executing this volumetric calibration process, orthree-dimensional scan, at two or more elevations is that thecalibration polynomials can be made to capture the errors of the scannerthat occur at different Z-elevations. For example, the distortion andnon-telecentricity of the telecentric lens can be substantiallydifferent when the test object surface is located at Z=0.600 mm insteadof at Z=0.000 mm. The calibration polynomials now become functions of Zin addition to angles θ_(N) and ϕ_(N): V_(XMEMS)=f(θ_(N), ϕ_(N), Z) andV_(YMEMS)=g(θ_(N), ϕ_(N), Z). The disadvantage to executing thecalibration process at two or more elevations is that the calibrationprocess now takes much longer to execute. Indeed, steps 702-712 in theflowchart of FIG. 7 must be executed for each Z-elevation. Referring toFIG. 1, the Z-elevation is controlled during the volumetric calibrationprocess by the calibration management apparatus 64 in which thecalibration management apparatus 64 issues commands to the Z-translationstage 70 to effect changes in the placement of the optical scannerdevice 54 in the Z-direction. Alternatively, the Z-translational stagemay be moved to change the placement of the planar calibration object 30in the Z-direction.

Once the calibration polynomials, or other calibration relationship, arecomputed for V_(XMEMS) and V_(YMEMS), the calibration process iscomplete in step 716 and the coefficients of the two polynomials by wayof example, are stored in memory 122 in the calibration managementapparatus 64 for later use during a measurement scan of a test object72.

FIG. 17 shows an exemplary method of utilizing the calibrationrelationship determined in the method illustrated in FIG. 7 to completea measurement scan of a test object, such as the text object 72 shown inFIG. 5. First, in step 800, the calibration management apparatusdetermines a plurality of measurement scanning angles for measuring thetest object 72 using the optical scanner device 54. During themeasurement scan, it is necessary to know the exact angles, θ_(N) andϕ_(N), of the MEMS mirror 26 for each point of the scan so thetriangulation algorithm can execute accurately for each scan point andproduce an error-free estimate of the location (X_(o), Y_(o), Z_(o)) ofthe projected light image 31 on the test object 72. Note that during ameasurement scan (lineal or areal) of the test object 72 a series of(X_(o), Y_(o), Z_(o)) data points is assembled which defines thethree-dimensional shape of the test object 72 across the scan points. Itis this three-dimensional shape that is the desired output of thethree-dimensional optical scanner system 10, and must be as error-freeas possible. By way of example, during the measurement scan thecalibration management apparatus 64 determines values for themeasurement scanning angles θ_(N) and ϕ_(N) based upon the desiredparameters of the scan (e.g., lineal versus areal scan, the scanenvelope, and the number of scan points).

Next, in step 802, the calibration management apparatus 64 computescorresponding measurement scan parameters for each of the measurementscanning angles, such as the necessary MEMS drive voltages, Y_(XMEMS)and V_(YMEMS) necessary to effect the scan measurement angles, using thecalibration relationship. In one example, the calibration relationshipis provided by the calibration polynomials, such as the polynomial ofequation 7.

In another example, the calibration relationship is a look up table ofvalues correlating computed scanning angles with corresponding scanparameters as described above. In this example, the raw values forV_(XMEMS), V_(YMEMS), θ_(N), ϕ_(N), and optionally Z, are stored in atabular format in memory 122 of the calibration management apparatus 64in a look-up table (LUT). In this example, in optional step 804, thecalibration management computing device 64 applies an interpolationalgorithm to compute the corresponding measurement scan parameter foreach of the plurality of measurement scanning angles in the LUT. In thisexample, the interpolation on the LUT data is used to find the precisevalues of V_(XMEMS) and V_(YMEMS) needed to effect the desired MEMSangles θ_(N) and ϕ_(N) (at, optionally, a given Z) during a measurementscan. This has the advantage of executing faster and retaining the highspatial frequency characteristics of the data (which polynomial fittingtends to smooth over because it is essentially a low-pass filter),although the interpolation results can also be noisier because the noiseis not removed or otherwise filtered by the polynomial fitting process.

The difficulty with using the LUT approach instead of the polynomialapproach is the interpolation needed to find the precise values of θ_(N)and ϕ_(N) (and optionally, Z) which generally lie between the entrieswithin the look-up table. An interpolation algorithm will be describedin which the desired voltage is a function of all three parameters,θ_(N), ϕ_(N), and Z, with the understanding that the two-parameterinterpolation, i.e., V=h(θ_(N), ϕ_(N)) is a simpler subset of thisalgorithm. An interpolation algorithm process following steps, althoughother algorithms are possible as well:

-   -   1) Obtain the desired values of θ_(N), ϕ_(N), and Z that the        MEMS drive voltage “V” is to be computed for (where V is either        V_(XMEMS) or V_(YMEMS)). These coordinates (θ_(N), ϕ_(N), Z) are        denoted as point “P”.    -   2) Find the four entries in the LUT whose distance, L, to the        point P are the smallest.    -   3) The four entries found in step 2) are the four corners of a        tetrahedron, and point P lies within the tetrahedron.    -   4) Using cross-product vector math, find the four-dimensional        vector that is perpendicular to the three-dimensional        tetrandron.    -   5) Plug a corner point of the tetrahedron into the        four-dimensional vector and obtain an equation of the form        Aθ_(N)+Bϕ_(N)+CZ+DV+E=0. The coefficients A, B, C, D, and E are        known at this juncture.    -   6) Solve the equation found in step 5) for V, which is the        required drive voltage for a channel of the MEMS.

In step 2) a distance L_(ijk), which is the distance from a point P tothe i'th Z entry in the table, the j'th θ_(N) entry, and the k'th ϕ_(N)entry, can be computed asL_(ijk)=sqrt[(Z−Z_(i))²+(θ_(N)−θ_(j))²+(ϕ_(N)−ϕ_(k))²].

Steps 4) through 6) are illustrated in greater detail below for theX-channel of the MEMS (i.e., V=Vx_(MEMS)). Beginning at step 4), assumethat the four corner points of the tetrahedron are known:C ₁=(θ₁,ϕ₁ ,Z ₁)C ₂=(θ₂,ϕ₂ ,Z ₂)C ₃=(θ₃,ϕ₃ ,Z ₃)C ₄=(θ₄,ϕ₄ ,Z ₄)Next, assemble three vectors, V₁, V₂, and V₃, for the X Voltage channelof the MEMS:V ₁ =C ₄ −C ₁=(θ₄−θ₁)θ+(ϕ₄−ϕ₁)ϕ+(Z ₄ −Z ₁)Z+(Vx ₄ −Vx ₁)VxV ₂ =C ₄ −C ₂=(θ₄−θ₂)θ+(ϕ₄−ϕ₂)ϕ+(Z ₄ −Z ₂)Z+(Vx ₄ −Vx ₁)VxV ₃ =C ₄ −C ₃=(θ₄−θ₃)θ+(ϕ₄−ϕ₃)ϕ+(Z ₄ −Z ₃)Z+(Vx ₄ −Vx ₁)Vx,

where θ, ϕ, Z and Vx are unit vectors.

The constants θ₄, θ₃, θ₂, θ₄, ϕ₄, ϕ₃, ϕ₂, ϕ₁, Z₄, Z₃, Z₂, and Z₁ werefound in step 2); the constants Vx₄, Vx₃, Vx₂, and Vx₁ are thecoordinates on the voltage axis corresponding to the corners of thetetrahedron.

The vector that is perpendicular to these vectors, V_(NX), is the tripleproduct of V₁, V₂, and V₃: V_(NX)=V₁×V₂×V₃

$\begin{matrix}{V_{NX} = {{Det}{\begin{matrix}\Theta & \phi & Z & {Vx} \\{\theta_{4} - \theta_{1}} & {\phi_{4} - \phi_{1}} & {Z_{4} - Z_{1}} & {{Vx}_{4} - {Vx}_{1}} \\{\theta_{3} - \theta_{1}} & {\phi_{3} - \phi_{1}} & {Z_{3} - Z_{1}} & {{Vx}_{3} - {Vx}_{1}} \\{\theta_{2} - \theta_{1}} & {\phi_{2} - \phi_{1}} & {Z_{2} - Z_{1}} & {{Vx}_{2} - {Vx}_{1}}\end{matrix}}}} \\{= {{A\;\Theta} + {B\;\phi} + {CZ} + {DVx}}}\end{matrix}\quad$

The equation of the tetrahedron is AΘ+Bϕ+CZ+DVx+E=0. The coefficient Ecan be found by plugging in known values for Θ, ϕ, Z, and Vx (such asΘ₄, ϕ₄, Z₄, and Vx₄) and solving for E. One gets the same answer for Eif either of C₁, C₂, C₃, or C₄ are plugged into the equation. Once thefive coefficients in the equation of the tetrahedron are known, it is asimple matter to plug in the desired or known values of Θ, ϕ, Z, andcompute Vx.

Referring again to FIG. 17, in step 806 the computed measurement scanparameters, such as voltages for driving the MEMS mirror 26 are used tocomplete a measurement scan of the test object 72. By way of example,the values for V_(XMEMS) and V_(YMEMS) are then used to drive the MEMSmirror 26 by the calibration management apparatus 64 by way of D/Aconverter 66X, X-MEMS channel driver 68X, D/A converter 66Y, and Y-MEMSchannel driver 68Y. The measurement scan, based on the utilizedcalibration process, reduces system errors in the scan.

It is important to note that the calibration process described above, inwhich the MEMS drive voltages V_(XMEMS) and V_(YMEMS) needed to effectactual MEMS mirror angles θ_(N) and ϕ_(N), captures not only how theMEMS mirror angles vary with applied drive voltage, but the calibrationprocess also captures other system errors that impact the location ofthe image 51 of the cross-hair on the image sensor 50. These systemerrors, listed earlier, include (but is not limited to) the placement ofthe light source 12; the mis-location of reticle 16; angular tip or tiltof projection lens 20; lateral mis-placement in Y or Z of projectionlens 20; angular tip or tilt of prism 22; lateral mis-placement in X, Y,or Z of prism 22; lateral mis-placement of MEMS 24 in the X, Y, or Zdirection; angular misplacement of the MEMS 24; lateral misplacement ofMEMS mirror 26 within the MEMS 24 in the X, Y, or Z direction; angularmisplacement of the MEMS mirror 26; errors in D/A Converters 66X and66Y; non-linearities and gain error in MEMS Drivers 68X and 68Y;non-linearities and cross-talk within the MEMS 24; and errors associatedwith the telecentric lens including optical distortion and residualnon-telecentricity. Since these errors and tolerances impact thelocation of the image 51 on the image sensor, which in turn can also becontrolled by controlling the MEMS mirror angles θ_(N) and ϕ_(N), thenit makes sense to account for and remedy these errors by controllingangles θ_(N) and ϕ_(N) accordingly to null their effects. It turns outthat the calibration process of the present technology captures thesesystem errors and corrects for them in the calculation and applicationof the calibration polynomials of V_(XMEMS) and V_(YMEMS).

As described and illustrated herein, this technology advantageouslyfacilitates calibrating the errors associated with an optical scanner inwhich the errors are characterized at the system level using a simpleand fast procedure, requiring the use of only one additional piece ofhardware—a planar calibration artifact. The present technologyadvantageously reduces the measurement errors of a diminutive andeconomical three-dimensional optical scanning device built fromcomponents that again have nominal tolerances by measuring or otherwisecalibrating the scanner as a whole. The scanner may then advantageouslybe operated without the use of a feedback mechanism.

Having thus described the basic concept of the invention, it will berather apparent to those skilled in the art that the foregoing detaileddisclosure is intended to be presented by way of example only, and isnot limiting. Various alterations, improvements, and modifications willoccur and are intended to those skilled in the art, though not expresslystated herein. These alterations, improvements, and modifications areintended to be suggested hereby, and are within the spirit and scope ofthe invention. Additionally, the recited order of processing elements orsequences, or the use of numbers, letters, or other designationstherefore, is not intended to limit the claimed processes to any orderexcept as may be specified in the claims. Accordingly, the invention islimited only by the following claims and equivalents thereto.

What is claimed is:
 1. A method for calibrating an optical scannerdevice implemented by a calibration management apparatus, the methodcomprising: providing instructions to the optical scanner device to scana calibration surface in a scan pattern based on one or more scanparameters, wherein the one or more scan parameters vary over the scanpattern; computing the scanning angle for each of the plurality ofpoints in the scan pattern based on an obtained image of a light sourceemitted from the optical scanner device at a scanning angle for aplurality of points in the scan pattern; determining a calibrationrelationship between the computed scanning angles and the correspondingone or more scan parameters for each of the plurality of points in thescan pattern; adjusting a distance between the optical scanner deviceand the calibration surface; and repeating the providing, computing, anddetermining steps at the adjusted distance between the optical scannerdevice and the planar calibration surface to obtain a three-dimensionalscan pattern.
 2. The method as set forth in claim 1, wherein the scanpattern is a one-dimensional scan pattern.
 3. The method as set forth inclaim 1, wherein the scan pattern is a two-dimensional scan pattern. 4.The method as set forth in claim 3, wherein the scan pattern is aserpentine pattern, a raster pattern, a random pattern, or apseudo-random pattern.
 5. The method as set forth in claim 1, whereinthe determining the calibration relationship further comprises:computing a polynomial providing a relationship between the computedscanning angles and the corresponding one or more scan parameters foreach of the plurality of points in the scan pattern.
 6. The method asset forth in claim 1, wherein the determining the calibrationrelationship further comprises: storing a table of values correlatingthe computed scanning angles and the corresponding one or more scanparameters for each of the plurality of points in the scan pattern. 7.The method as set forth in claim 1, wherein the one or more scanparameters comprise a voltage used to control an angular position of amirror in the optical scanner device configured to determine thescanning angle of the optical scanner device.
 8. The method as set forthin claim 1 further comprising: determining a plurality of measurementscanning angles for measuring a test object using the optical scannerdevice; and computing a corresponding measurement scan parameter foreach of the plurality of measurement scanning angles using thecalibration relationship between the computed scanning angles and thecorresponding one or more scan parameters for each of the plurality ofpoints in the scan pattern.
 9. The method as set forth in claim 8,wherein the plurality of measurement scanning angles for measuring thetest object using the optical scanner device are determined based on oneor more of a type of scan, a scan envelope, or a number of scan points.10. The method as set forth in claim 8, wherein the calibrationrelationship comprises a table of values correlating the computedscanning angles and the corresponding one or more scan parameters foreach of the plurality of points in the scan pattern and the computingthe corresponding measurement scan parameter further comprises: applyingan interpolation algorithm to compute the corresponding measurement scanparameter for each of the plurality of measurement scanning angles usingthe table of values.
 11. A calibration management apparatus comprisingmemory comprising programmed instructions stored thereon and one or moreprocessors configured to be capable of executing the stored programmedinstructions to: provide instructions to an optical scanner device toscan a calibration surface in a scan pattern based on one or more scanparameters, wherein the one or more scan parameters vary over the scanpattern; compute the scanning angle for each of the plurality of pointsin the scan pattern based on an obtained image of a light source emittedfrom the optical scanner device at a scanning angle for a plurality ofpoints in the scan pattern; determine a calibration relationship betweenthe computed scanning angles and the corresponding one or more scanparameters for each of the plurality of points in the scan pattern;adjust a distance between the optical scanner device and the calibrationsurface; and repeat the provide, compute, and determine steps at theadjusted distance between the optical scanner device and the planarcalibration surface to obtain a three-dimensional scan pattern.
 12. Theapparatus as set forth in claim 11, wherein the scan pattern is aone-dimensional scan pattern.
 13. The apparatus as set forth in claim11, wherein the scan pattern is a two-dimensional scan pattern.
 14. Theapparatus as set forth in claim 13, wherein the scan pattern is aserpentine pattern, a raster pattern, a random pattern, or apseudo-random pattern.
 15. The apparatus as set forth in claim 11,wherein the one or more processors are further configured to be capableof executing the stored programmed instructions to: compute a polynomialproviding a relationship between the computed scanning angles and thecorresponding one or more scan parameters for each of the plurality ofpoints in the scan pattern.
 16. The apparatus as set forth in claim 11,wherein the one or more processors are further configured to be capableof executing the stored programmed instructions to: store a table ofvalues correlating the computed scanning angles and the correspondingone or more scan parameters for each of the plurality of points in thescan pattern.
 17. The apparatus as set forth in claim 11, wherein theone or more scan parameters comprise a voltage used to control anangular position of a mirror in the optical scanner device configured todetermine the scanning angle of the optical scanner device.
 18. Theapparatus as set forth in claim 11, wherein the one or more processorsare further configured to be capable of executing the stored programmedinstructions to: determine a plurality of measurement scanning anglesfor measuring a test object using the optical scanner device; andcompute a corresponding measurement scan parameter for each of theplurality of measurement scanning angles using the calibrationrelationship between the computed scanning angles and the correspondingon or more scan parameters for each of the plurality of points in thescan pattern.
 19. The apparatus as set forth in claim 18, wherein theplurality of measurement scanning angles for measuring the test objectusing the optical scanner device are determined based on one or more ofa type of scan, a scan envelope, or a number of scan points.
 20. Theapparatus as set forth in claim 18, wherein the calibration relationshipcomprises a table of values correlating the computed scanning angles andthe corresponding one or more scan parameters for each of the pluralityof points in the scan pattern and wherein the one or more processors arefurther configured to be capable of executing the stored programmedinstructions to: apply an interpolation algorithm to compute thecorresponding measurement scan parameter for each of the plurality ofmeasurement scanning angles using the table of values.
 21. Anon-transitory computer readable medium having stored thereoninstructions for calibrating an optical scanner device comprisingexecutable code which when executed by one or more processors, causesthe one or more processors to: provide instructions to an opticalscanner device to scan a calibration surface in a scan pattern based onone or more scan parameters, wherein the one or more scan parametersvary over the scan pattern; compute the scanning angle for each of theplurality of points in the scan pattern based on an obtained image of alight source emitted from the optical scanner device at a scanning anglefor a plurality of points in the scan pattern; determine a calibrationrelationship between the computed scanning angles and the correspondingscan parameters for each of the plurality of points in the scan pattern;adjust a distance between the optical scanner device and the calibrationsurface; and repeat the provide, compute, and determine steps at theadjusted distance between the optical scanner device and the planarcalibration surface to obtain a three-dimensional scan pattern.
 22. Themedium as set forth in claim 21, wherein the scan pattern is aone-dimensional scan pattern.
 23. The medium as set forth in claim 21,wherein the scan pattern is a two-dimensional scan pattern.
 24. Themedium as set forth in claim 23, wherein the scan pattern is aserpentine pattern, a raster pattern, a random pattern, or apseudo-random pattern.
 25. The medium as set forth in claim 21, whereinthe executable code when executed by the one or more processors furthercauses the one or more processors to: compute a polynomial providing arelationship between the computed scanning angles and the correspondingone or more scan parameters for each of the plurality of points in thescan pattern.
 26. The medium as set forth in claim 21, wherein theexecutable code when executed by the one or more processors furthercauses the one or more processors to: store a table of valuescorrelating the computed scanning angles and the corresponding one ormore scan parameters for each of the plurality of points in the scanpattern.
 27. The medium as set forth in claim 21, wherein the one ormore scan parameters comprise a voltage used to control an angularposition of a mirror in the optical scanner device configured todetermine the scanning angle of the optical scanner device.
 28. Themedium as set forth in claim 21, wherein the executable code whenexecuted by the one or more processors further causes the one or moreprocessors to: determine a plurality of measurement scanning angles formeasuring a test object using the optical scanner device; and compute acorresponding measurement scan parameter for each of the plurality ofmeasurement scanning angles using the calibration relationship betweenthe computed scanning angles and the corresponding one or more scanparameters for each of the plurality of points in the scan pattern. 29.The medium as set forth in claim 28, wherein the plurality ofmeasurement scanning angles for measuring the test object using theoptical scanner device are determined based on one or more of a type ofscan, a scan envelope, or a number of scan points.
 30. The medium as setforth in claim 28, wherein the calibration relationship comprises atable of values correlating the computed scanning angles and thecorresponding one or more scan parameters for each of the plurality ofpoints in the scan pattern and wherein the executable code when executedby the one or more processors further causes the one or more processorsto: apply an interpolation algorithm to compute the correspondingmeasurement scan parameter for each of the plurality of measurementscanning angles using the table of values.